Contact and Via Array Analysis

Summary:
Automated analysis, measurement and characterization of arrays of holes, including contact and via arrays. Outputs include major and minor CD, as well as measurement of deviations of individual rows or columns from the uniform order, including alignment and spatial distribution for the entire array. Individual metrics for each separate hole are also provided, plus histograms

Image Types Supported:
Digital Images from CD-SEM, TEM, AFM and Optical Imaging tools.

Sample Report:

Sample Preparation:
Sample preparation and imaging services are available through qualified Service Partners.

Analysis Metrics/Outputs:

	Width
	Height
	Width standard deviation
	Height standard deviation
	Area
	Interaxis distance
	Interspot distance
	Spot to axis distance
	Spot to position on axis distance
	Shifts
	Interspot distance
	Tilt angle
	Individual and group metrics

Customization of features, configuration settings, results and reports is available.