Contact and Via Array Analysis

Solution Summary:
Automated analysis and characterization of uniform hole-like structures, including gate and via arrays. Quantification of major and minor CD, as well as array metrics, including: deviations from the uniform order, alignment, spatial distribution and more. Standard and advanced statistical data analysis is supported.

Supported Image Types:
Digital Images from CD-SEM, TEM, AFM and Optical Imaging tools.

Sample Report:

Sample preparation:
Sample preparation and imaging services are available, if needed, through our qualified Service Partners.

Analysis Metrics/Outputs:

	Width
	Height
	Width standard deviation
	Height standard deviation
	Area
	Interaxis distance
	Interspot distance
	Spot to axis distance
	Spot to position on axis distance
	Shifts
	Interspot distance
	Tilt angle
	Individual and group metrics

Customization of features, configuration settings, results and reports is available.