SEM Trench Cross-section Analyzer

Solution Summary:
This solution provides automated analysis of SEM or TEM  trench images for semiconductor applications. Application provides statistical analysis of trench geometry, dimensioning of elements and automated reporting of statistical distribution of measurements. Application areas may include qualitative (pass/fail) and quantitative analysis, inspection and identification of defects for semiconductor samples.

Source Image:
Digital Images of semiconductors from SEM, TEM, AFM or Optical Microscopy

Sample preparation:
Sample preparation and imaging services are available through our Service Partners.

Sample Report:

Determined Parameters:

	Dimensions of the elements: height, depth, thickness
	Pitch, periodicity
	Geometry: lines, slopes, angles
	Contact Area (if any)
	Symmetry

Application features, configuration settings, results and reports are customizable to satisfy specific client requirements.